Usayizi ohlangene, inzwa yomugqa womugqa ezwela kakhulu, emboza ukukhanya kwe-ultraviolet, eduze nobubanzi be-infrared (200~ 1000 nm), isekela uxhumano lwe-USB, kululaukuhlanganiswa kwezimboni nokulawula.
I-JINSP ye-multi-purpose compact fibre optic spectrometer ibonakala ngosayizi omncane, ukusebenza okuphezulu, ukonga, kanye nokuguquguquka.Ifaneleka kahle ekwakheni amasistimu okulinganisa okubonwayo ahlukahlukene, okuvumela ukuboniswa, ukudluliswa, kanye nokumuncwa kwe-spectraububanzi 200 ukuze 1100 nm.
I-spectrometer isebenzisa i-diffraction evutha umlilo yekhwalithi ephezulu yemboni kanye nedizayini yokubona enhle kakhulu ukuze kuqinisekiswe ukukhanya okukhanyayo okukhanyayo (okuphumayo) nokuthuthukisa amandla okuthola isignali abuthakathaka.Ukushintsha ama-diffraction grating kuhlanganiswe ukuminyana kwemigqa ehlukahlukene, ukutholwa kwe-spectral okunokulungiswa okuphezulu kungafinyelelwa kumabhande e-ultraviolet, abonakalayo, naseduze kwe-infrared.Ifakwe i-CMOS chip ye-2048-pixel ephezulu ye-quantum esebenza kahle kakhulu kanye nesivinini esiphezulu sokuthola isignali enomsindo ophansi kanye nokucutshungulwa kwesekethe, iletha i-spectral ephelele.isilinganiso sesignali-kuya-nomsindo.
Inzwa yangaphakathi yokushisa ehlanganisiwe ingakwazi ukuqapha izinga lokushisa le-ambient ngesikhathi sangempela.Ihlanganiswe ne-algorithm yesinxephezelo se-temperature drift yangaphakathi, ingafinyelelaukukhukhuleka okuncane kakhulu kwezinga lokushisa ngaphakathi kwebanga lokushisa lokusebenza.
Ngokukhethekile, i-SR50C isebenzisa indlela yokubona ye-CT ephambanayo, enikeza ukuzwela okuphezulu.I-SR75C isebenzisa isibuko esibukisayo esingu-75mm ubude esihambisana nohlobo lwe-M-CTidizayini ye-optical, iqinisekisa ukuphuma kahle kwe-optical nokuxazulula.I-SR50D ihlanganisa indlela yokubona ye-CT ephambanayo kanye ne-chip yokupholisa ye-semiconductor edidiyelwe ngaphakathi, evumela i-chip ukuthi isebenze ku-5°C (izinga lokushisa elilungisekayo) ukuze kuthuthukiswe ukuzinza kwesignali.
| Imodeli | I-SR50C | I-SR75C | I-SR50D | |||
| Ukuklama/Ukubukeka |  |  |  | |||
| Izici ezibalulekile | Ukuzwela okuphezulu | Kuqiza kahle | Ukulungiswa okuphezulu | Kuqiza kahle | Isilinganiso esiphezulu sesignali-kuya-noise | Ukupholisa, umsindo ophansi |
| Ubukhulu | 76 mm(ububanzi)× 65 mm(ukujula)× 36 mm(ubude) | 110 mm(ububanzi)× 95 mm(ukujula)× 43 mm(ubude) | 76 mm (ububanzi)× 65 mm (ukujula)× 36 mm (ubude) | |||
| Isisindo | 220g | 310g | 220g | |||
| Ubude bokugxila | ≤50mm | ≤75mm | ≤50mm | |||
| Uhlobo lwe-chip | Uhlu lomugqa CMOS, Hamamatsu S11639 | |||||
| Ububanzi bendawo yokungena | 10μm, 25μm, 50μm, 100μm, 200μm | |||||
| I-fiber interface yokufaka | I-SMA905, indawo yamahhala | |||||
| Ukujula kancane kwe-ADC | 16 kancane | |||||
| Ukunikezwa kwamandla kagesi | I-DC 4.5V ukuya ku-5.5V (uhlobo @5V) | |||||
| Ukusebenza kwamanje | <500mA | |||||
| Izinga lokushisa lokusebenza | 10 ~ 40 ℃ | |||||
| Izinga lokushisa lesitoreji | -20 ~ 60 ℃ | |||||
| Umswakama ohlobene | 0~90%RH | |||||
| Iphrothokholi yokuxhumana | I-modbus | |||||
Izindawo zokufaka isicelo:
Ukumuncwa, ukudluliswa kwe-transmittance, nokubonakala kokubukeka Ku-ultraviolet, okubonakalayo, kanye nobubanzi obuseduze ne-infrared
Ukutholwa komthombo wokukhanya kanye ne-laser wavelength
Imojula yomkhiqizo we-OEM:
I-LIBS - ukuhlaziywa kwenhlabathi namaminerali ukuze kuhlolwe i-geological kanye nomsebenzi ohlobene nezimayini
Ukuqapha nge-inthanethi izinga lamanzi nokuvikelwa kwemvelo - izinto eziphilayo kanye nokuqukethwe komoyampilo emanzini
I-Flue gas - Ukuqapha kanye nokuhlonza izingxenye ezikhipha igesi ephumayo
